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Solderless Breadboard 400 Tie Points

Location: /Prototyping/Breadboards

Solderless Breadboard 400 Tie Points

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QtyPriceExtended
1C$3.4950C$3.50
4C$3.0450C$12.18
10C$2.7700C$27.70
DIPMICRO DISCONTINUED

400 contact points modular breadboard for quick and easy circuit testing and experimentation. ABS plastic material, phosphor bronze nickel plated spring clips, accepts 20-29 AWG, coloured coordinates for easy component placement.

Product Information
dipmicro Code DE2632
Manufacturer Generic
Manufacturer P/N BB-801
Stock Type New
Restockable? Yes, we can get more. ASK
Shipping Weight 55g / 1.94oz
 
Technical Summary
Dimensions 53 x 82 x 8.5mm
Terminal Strips 1
Tie Points 300
Distribution Points 2 (100 tie points)
Total Points 400
Binding Posts -