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Solderless Breadboard 830 Tie Points

Location: /Prototyping/Breadboards

Solderless Breadboard 830 Tie Points

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QtyPriceExtended
1C$5.5410C$5.54
4C$5.1250C$20.50
10C$4.5200C$45.20
DIPMICRO DISCONTINUED

830 contact points modular breadboard for quick and easy circuit testing and experimentation. ABS plastic material, phosphor bronze nickel plated spring clips, accepts 20-29 AWG, coloured coordinates for easy component placement.

Product Information
dipmicro Code DE2630
Manufacturer Generic
Manufacturer P/N BB-102
Stock Type New
Restockable? Yes, we can get more. ASK
Shipping Weight 0.10kg / 3.53oz
 
Technical Summary
Dimensions 56 x 165 x 8.5mm
Terminal Strips 1
Tie Points 630
Distribution Points 2 (200 tie points)
Total Points 830
Binding Posts -